Aosi Bang 189 silicone thermal silica, thermal plastic, thermal plastic, silicone heat 
 Thermal conductivity thermal silica gel thermal plastic glue 
 I. Introduction 
 Aosi Bang 189 is a single component room temperature curing silicone thermal conductivity: 
 1, one-component, room temperature curing, easy to use, no latch or screws. 
 2, has a good thermal conductivity, heat dissipation, adhesive properties. 
 2, neutral curing, curing speed, the vast majority of metal has good adhesion, no corrosion; long-term use will not fall off, will not have access to reduce the cooling effect of the gap; 
 4, the adhesive has excellent resistance to changes in the level of performance, aging resistance, electrical insulation and excellent moisture, shock, corona resistant, anti-leakage performance. 
 5. In full compliance with the EU ROHS directive. 
 Second, the typical use 
 As a heat transfer medium for heat conduction between the heat sink with the CPU, cooling, insulation, such as: CPU and cooler, thyristor control module and heat sink, high-power components and between the radiator filled, sticky Next, heat. 
 Third, other information 
 For more detailed product technical data in English (TDS), use of technology, material safety data sheets (MSDS), Environmental Report (SGS), please contact your local sales representative or dealer Aosi Bang. 

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 Address: Bao'an District, Shenzhen City, Baoan Road, Xixiang Town, Shu Tsung Yuen Building, 8th Floor